Waterjet vs. laser—when combined, they become unstoppable. Have you ever seen this cutting method before?
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2021-03-25
Waterjet cutting and laser cutting are widely used methods today, and they’ve proven to be the most effective cutting solutions in the industry. However, researchers haven’t stopped exploring even better cutting techniques. For instance, when it comes to processing intricate metal components or cutting advanced new materials, there’s a growing need for innovative approaches—leading to the development of the unique Waterjet-Laser Cutting technology.

With the emergence of new materials such as carbon-fiber-reinforced polymers and ceramic matrix composites, machining these advanced materials has become a growing challenge.
Both waterjet and laser cutting have certain limitations, so to address this challenge, waterjet-laser cutting technology has been developed specifically for processing these advanced composite materials.
Waterjet laser cutting is a hybrid manufacturing process, also known as laser micro-jetting, which combines laser technology with a "thin" water jet. The water jet—referred to as the "water knife"—precisely directs the laser beam in a manner similar to conventional fiber optics, enabling accurate cutting. At the same time, the water jet continuously cools the cutting area and efficiently removes debris generated during the process.

When focused, the laser beam forms a concentrated stream that propels water forward as it passes through the pressurized water chamber—and is then directed precisely toward the nozzle. Finally, the laser beam exits the nozzle along with the water flow. Importantly, no abrasive material is added to this water stream, meaning the cutting action relies primarily on the laser itself. The water serves two key purposes: first, it acts as a guiding medium to keep the laser beam tightly focused and prevent it from scattering, thereby concentrating the laser energy for faster cutting; and second, it helps cool the system and efficiently removes the resulting debris.

From the nozzle to the workpiece, the laser beam doesn’t diverge—it instead continuously reflects within the water column as it advances. This principle is similar to fiber-optic transmission, allowing the laser beam to be precisely guided over distances of up to 10 cm, resulting in clean, well-defined cuts without the need for refocusing or precise distance control.

This technology was initially applied to semiconductor wafer cutting, and as the technology matured, it has gradually expanded into areas such as medical equipment, watchmaking, gas and jet engine turbine blades, mechanical processing of semiconductor devices, and material cutting in the manufacturing of ultra-hard tools.
For fabricators, waterjet laser cutting offers faster production speeds, a wider range of processable materials, greater reliability, and superior cutting quality—all while driving down cutting costs. And as more new materials continue to emerge, waterjet laser cutting, with all its remarkable features, is poised for even broader adoption.
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